Multilayer printed circuit board and production thereof
AssigneeHitachi, Ltd.
InventorsAkira Nagai, Shin Nishimura, Masahiro Suzuki, Masao Suzuki, Junichi Katagiri, Akio Takahashi, Akio Mukoh
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Abstract
A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.
Claims4
A fluorine-containing thermosetting resin composition comprising
- 100 parts by weight of a biscyanamide compound represented by the formula:
- ##STR15## wherein X is --O--, --S--, --SO--, --SO.sub.2 --, --CO--, or ##STR16## R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are independently a hydrogen atom, a lower alkylgroup, a lower fluoroalkyl group, or an allylene group;
- n is zero or an integer of 1;
- Rf is a perfluoroalkyl group having 1 to 10 carbon atoms;
- and the cyanamide group is positioned at a m- or p-position with respect to the ether linkage, and
- 10to 900 parts by weight of at least one secondary thermosetting component selected from the group consisting of compound having one or more ethylenically unsaturated double bonds, epoxy compounds, phenolic compounds, melamine compounds, compounds having an N-substituted unsaturated imido group, cyanate compounds, and isocyanate compounds.
An insulating cured product obtained by heating at 100.degree. to 250.degree. C. a fluorine-containing thermosetting resin composition comprising a biscyanamide compound of the formula:
- ##STR17## wherein X is --O--, --S--, --SO--, --SO.sub.2 --, --CO--, or ##STR18## R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are independently a hydrogen atom, a lower alkyl group, a lower fluoroalkyl group, or an allylene group;
- n is zero or an integer of 1;
- Rf is a perfluoroalkyl group having 1 to 10 carbon atoms;
- the cyanamide group is positioned at a m- or p-position with respect to the ether linkage, said cured product having melamine rings and/or isomelamine rings, a relative dielectric constant at 1 MHz of 3.0 or less, a 5% weight loss temperature of 400.degree. C. or higher, and fire retardance of V-O according to UL-90 standards.
A curable sheet obtained by impregnating a woven fabric or non-woven fabric and drying, with a fluorine-containing thermosetting resin composition comprising a biscyanamide compound of the formula:
- ##STR19## wherein X is --O--, --S--, --SO--, --SO.sub.2 --, --CO--, or ##STR20## R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are independently a hydrogen atom, a lower alkyl group, a lower fluoroalkyl group, or an allylene group;
- n is zero or an integer of 1;
- Rf is a perfluoroalkyl group having 1 to 10 carbon atoms;
- and the cyanamide group is positioned at a m- or p-position with respect to the ether linkage.
Dependencies are inferred from the claim text.