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AssigneeShin-Etsu Chemical Co., Ltd.
InventorsAkio Nakano, Tsutomu Yoneyama, Nobumasa Tomizawa
Estimating the term…
A silicone rubber composition having thermal conductivity higher than 5.times.10.sup.-3 cal/cm.multidot.sec.multidot..degree.C. and excellent workability in various molding processes, which comprises A) 95-50 parts by weight of an organopolysiloxane having an average polymerization degree of 6,000-12,000, B) 5-50 parts by weight of an organopolysiloxane having an average polymerization degree of 200-2,000, C) 500-1,200 parts by weight of a spherical aluminum oxide powder and D) a curing agent ample for curing the composition consisting of A) to C) .
A thermally conductive silicone rubber composition having thermal conductivity of 5.times.10.sup.-3 .multidot.cal/cm.multidot.sec.multidot..degree.C. or higher which consists essentially of A 95-50 parts by weight of a gummy organopolysiloxane having an average polymerization degree of 6,000-12,000, B) 5-50 parts by weight of an oily organpolysiloxane having an average polymerization degree of 200-2,000 and a viscosity of 600 to 120,000 centistokes, C) 500-1,200 parts by weight of a spherical aluminum oxide powder having an average particle size of 50 .mu.um or less and an average major axis diameter/minor axis diameter ratio of 1.0 to 1.4, and D) a curing agent in an amount sufficient to cure the composition.
Dependencies are inferred from the claim text.