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US 5,352,633 AGranted
Semiconductor lead frame lead stabilization
AssigneeTexas Instruments Incorporated
InventorDonald C. Abbott
Life of this patent
Estimating the term…
Abstract
The invention is to an apparatus and method for applying a plastic material to a lead frame for stabilizing the leads and retaining them in a common plane.
Claims10
A method for stabilizing multiple leads on a lead frame, including a mounting pad and lead fingers, comprising the steps of:
- aligning selected portions of the lead fingers, spaced from the mounting pad, with a plastic preform;
- and
- applying heat and pressure to the lead frame and plastic preform to melt the plastic causing it to flow around the selected portions of the lead frame leads, securing them in fixed relationship with each other.
A method for stabilizing multiple leads on a lead frame, including a mounting pad and lead fingers, comprising the steps of:
- aligning selected intermediate portions of the lead fingers, spaced from the mounting pad, with a plastic preform mounted on a carrier base;
- applying heat and pressure to the lead frame and plastic preform to melt the plastic causing it to flow around the lead frame leads securing them in fixed relationship with each other;
- and
- removing the preform carrier base.
1 more element
Dependencies are inferred from the claim text.