Microwave component test method and apparatus
AssigneeGeneral Electric Company
InventorsWilliam P. Kornrumpf, David A. Bates
Life of this patent
Estimating the term…
Abstract
A test fixture for testing microwave components enables components to be tested with high correlation between the component's test results and its operation in a system. The test fixture provides for non-destructive mounting of and connection of the component to the test fixture in the same manner as it will be connected in the final system and also provides for tailoring of the test connections as may be desired.
Claims17
A method of pre-testing microwave components comprising the steps of:
- providing a test fixture comprising a test substrate including:
- a mounting location for a component to be tested,
- first and second microwave transmission lines for connection to said component to be tested when said component to be tested is disposed at said mounting location, said first and second microwave transmission lines each having first and second ends, each of said first ends being disposed in the vicinity of said mounting location and each of said second ends being disposed remote from said mounting location, and
- a power supply terminal for connection to said component to be tested;
- disposing said component to be tested at said mounting location;
- connecting said first end of said first microwave transmission line to a first microwave port of said component to be tested, said first end of said second microwave transmission line to a second microwave port of said component to be tested and said power supply terminal to a power supply terminal of said component to be tested by the steps of:
- bonding a dielectric overlay layer to said test fixture and said component to be tested,
- providing an aperture in said dielectric overlay layer to expose conductive material on said component to be tested, and
- disposing a pattern of conductors on said dielectric overlay layer in ohmic contact with said power supply and control signal terminals, said first and second transmission lines and said conductive material on said component to be tested;
- applying power and a test signal to said component to be tested;
- and
- determining the response of said component to be tested to said test signal.
A method of pre-testing microwave components comprising the steps of:
- providing a test fixture comprising a test substrate having a conductive surface and an open cavity for mounting a component to be tested;
- disposing said component to be tested at said mounting location, said component to be tested having contact pads on a first surface thereof and including a first microwave port;
- applying a dielectric overlay over said substrate and said first surface of said component and bridging any gap between said first surface of said component and the adjacent portion of the surface of said substrate and providing via holes in said dielectric layer in alignment with appropriate ones of said contact pads;
- forming a pattern of conductors on said dielectric overlay, said conductors including a first signal conductor which comprises a first microwave transmission line, said first signal conductor being connected to said first microwave port of said component to be tested;
- connecting a test probe to appropriate portions of said pattern of conductors;
- applying appropriate test signals to said component to be tested;
- and
- determining the response of said component to said test signal.
Testing apparatus for use in testing microwave components, said apparatus comprising:
- a test substrate including:
- a mounting location for a component to be tested, and
- first and second test ports for connection to said component to be tested when said component to be tested is disposed at said mounting location, said first test port being a microwave port and coupled to a microwave transmission line, said microwave transmission line having a second end disposed remote from said mounting location;
- a dielectric overlay layer bonded to said test fixture and said component to be tested, said dielectric overlay layer having apertures exposing conductive material on said component to be tested and exposing said first and second test ports;
- and
- a pattern of conductors on said dielectric overlay layer in ohmic contact with said first and second test ports and said conductive material on said component to be tested for electrically connecting said component to be tested to said test ports.
Dependencies are inferred from the claim text.