Back to results
US 5,350,826 AGranted
Epoxy resin composition containing a polyaminoamide and a latent curing agent for fiber impregnation
AssigneeTonen Corporation
InventorsOsamu Watanabe, Makoto Takezawa
Life of this patent
Estimating the term…
Abstract
An epoxy resin composition for forming prepregs is disclosed which includes an epoxy resin having at least two epoxy groups, a latent curing agent for the epoxy resin in an amount of 0.5-3.0 equivalents per equivalent of the epoxy groups of the epoxy resin, and a reactive, viscosity-increasing agent in an amount of 0.2-3.0 parts by weight per 100 parts by weight of the epoxy resin. The epoxy resin composition has an initial viscosity n.sub.I(50) at 50.degree. C. of 1,000-200,000 cP and an initial viscosity n.sub.I(23) at 23.degree. C. of at least 10,000 cP.
Claims5
An epoxy resin composition comprising:
- an epoxy resin having at least two epoxy groups;
- a latent curing agent for said epoxy resin in an amount of 0.5-3.0 equivalents per equivalent of the epoxy groups of said epoxy resin said latent curing agent having a reaction initiation temperature of 40.degree.-115.degree. C.;
- and
- a reactive, viscosity-increasing agent selected from the group consisting of aromatic diamines and polyaminoamides, said reactive, viscosity-increasing agent being present in an amount of 0.2-3.0 parts by weight per 100 parts by weight of said epoxy resin, said epoxy resin composition having an initial viscosity n.sub.I (50) at 50.degree. C. of 1,000-200,000 cP and an initial viscosity n.sub.I (23) at 23.degree. C. of at least 10,000 cP, said reactive viscosity-increasing agent serving to increase said initial viscosity n.sub.I (50) to 50,000-1,500,000 cP when maintained at 23.degree. C. for 7 days, said composition exhibiting a viscosity at 50.degree. C. of no more than 50 times the initial viscosity n.sub.I (50) when maintained at 23.degree. C. for 7 days.
1 more element
Dependencies are inferred from the claim text.