Copper bonding epoxy resin compositions, resin coated copper articles and method
AssigneeGeneral Electric Company
InventorsMark Markovitz, William E. Tomak
Life of this patent
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Abstract
A bare copper conductor is provided with a tenaciously adhering epoxy resin by heating and curing in situ on the conductor a coating of a solution of cycloaliphatic epoxy resin, a hardener, stannous octoate as a catalyst, and a phenolic accelerator.
Claims10
An article of manufacture comprising a copper wire covered by a tightly-adhering, electrically-insulating, thermosetting composition coating which is hard, glassy and cracks but does not flake when the wire is bent around a 0.50 inch mandrel, the coverd wire being made by coating the wire with a solventless clear solution of a composition consisting essentially of 35 to 65% of 3,4 epoxy cyclohexylmethyl-(3,4 epoxy) cyclohexane carboxylate resin, 65 to 35% of a hardener for the epoxy resin selected from the group consisting of a dimerized unsaturated fatty acid and a trimerized unsaturated fatty acid and mixtures thereof, and a small but effective amount of stannous octoate catalyst and 0-3% of phenolic accelerator, and curing the said composition by heating the copper wire and the coating thereon.
The method of producing an electrically insulated copper wire which comprises the steps of providing a copper body having an oil film-free surface portion, preparing a solventless thermoserring resin composition which is a liquid solution at 25.degree. C. and consists essentially of about 35 to 65% 3,4 epoxy cyclohexylmethyl- (3,4 epoxy) cyclohexane carboxylate resin and about 65 to 35% of a hardener for the epoxy resin selected from the group consisting of a dimerized unsaturated fatty acid and a trimerized unsaturated fatty acid and mixtures thereof and a small but effective amount of stannous octoate catalyst and 0 to 3% of phenolic accelerator, covering the oil film-free surface portion of the copper wire with the liquid resin solution, and finally heating the copper wire and curing the resin covering thereon in situ.
The method of producing an electrically insulated copper wire which comprises the steps of providing an as-received copper wire, preparing a solventless thermosetting resin composition which is a liquid solution at 25.degree. C. and consists essentially of about 35 to 65% 3,4 epoxy cyclohexylmethyl--(3,4 epoxy) cyclohexane carboxylate and about 65 to 35% a hardener for the epoxy resin selected from the group consisting essentially of a dimerized unsaturated fatty and a trimerized unsaturated fatty acid and mixtures thereof and a small but effective amount of stannous octoate catalyst and 0 to 3% of phenolic accelerator, covering the surface of the as-received copper wire with the liquid resin solution, and finally heating the copper wire and curing the resin covering thereon is situ and thereby producing a coating on the wire which is hard, glassy and cracks but does not flake when the wire is bent around a 0.50 inch mandrel.
Dependencies are inferred from the claim text.