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AssigneeHitachi Chemical Company, Ltd.
InventorsNobuo Ichimura, Mitsuo Yamazaki, Kohei Fujita, Hidetaka Satou, Yasuo Miyamoto, Masao Kawasumi, Tohru Kikuchi
Estimating the term…
An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
A process for producing a semiconductor device which comprises bonding a semiconductor chip to a metallic layer with an adhesive composition;
A semiconductor device comprising a lead frame, an adhesive composition coated on an island of the lead frame, a semiconductor element placed on the adhesive composition and bonded to the island of the lead frame via the adhesive composition, wires connecting the semiconductor element and the lead frame, and a molded resin encapsulating the whole of the lead frame and the semiconductor element;
Dependencies are inferred from the claim text.