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US 5,350,713 AGranted
Design and sealing method for semiconductor packages
AssigneeVLSI Technology, Inc.
InventorLouis H. Liang
Life of this patent
Estimating the term…
Abstract
Several methods of forming an integrated circuit package by ultrasonically welding a thermal plastic material which joins two housing portions together in such a fashion as to seal an integrated circuit within the two housing portions is described along with the resulting structures of those methods.
Claims20
A method for housing an integrated circuit comprising the steps of:
- forming first and second housing portions adapted to be joined together to house said integrated circuit;
- forming a groove having serrated walls in said first housing portion;
- insert molding a thermal plastic material into said groove of said first housing portion to form a thermal plastic joint area therein;
- forming a thermal plastic joint area on said second housing portion;
- and
- bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint areas of said first and second housing portions.
3 more elements
A method for housing an integrated circuit comprising the steps of:
- forming first and second housing portions adapted to be joined together to house said integrated circuit;
- forming a groove in said first housing portion;
- press-fitting a seal ring comprising a thermal plastic material into said groove formed in said first housing portion to form a thermal plastic joint area therein;
- forming a thermal plastic joint area on said second housing portion;
- and
- bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint areas of said first and second housing portions.
3 more elements
A method for housing an integrated circuit comprising the steps of:
- forming, from non-thermal plastic material, first and second housing portions adapted to be joined together to house said integrated circuit;
- forming a groove having serrated walls in said first housing portion;
- insert molding a thermal plastic material into said groove of said first housing portion to form a thermal plastic joint area therein;
- forming a thermal plastic joint area on said second housing portion;
- and
- bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint areas of said first and second housing portions.
3 more elements
A method for housing an integrated circuit comprising the steps of:
- forming, from non-thermal plastic material, first and second housing portions adapted to be joined together to house said integrated circuit;
- forming a groove in said first housing portion;
- press-fitting a seal ring comprising a thermal plastic material into said groove formed in said first housing portion to form a thermal plastic joint area therein;
- forming a thermal plastic joint area on said second housing portion;
- and
- bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint areas of said first and second housing portions.
3 more elements
A method for housing an integrated circuit comprising the steps of:
- forming first and second housing portions adapted to be joined together to house said integrated circuit;
- forming a layer of graphite particles on a surface of said first housing portion;
- forming a thermal plastic joint area on said second housing portion;
- and
- bringing said first and second housing portions together, and joining them together by ultrasonically welding together said thermal plastic joint area of said second housing portion to said layer of graphite particles on said surface of said first housing portion.
2 more elements
Dependencies are inferred from the claim text.