A method of manufacturing a product comprising a substrate formed of cardboard, or a similar deformable material, on which a deferred-action adhesive is disposed for delayed use of adhesive, comprising the steps of:
- establishing relative movement between the substrate and a source of deferred-action adhesive;
- applying said adhesive in a liquid state from said source onto said substrate to produce a substantially continuous band of adhesive along the surface of the substrate;
- cooling the band of adhesive to increase the viscosity of the adhesive therein;
- applying a strip of removable protective material to the adhesive band to cover it;
- compressing the substrate in the region traversed by said adhesive band and said tape so that the exposed surface of said strip is not substantially higher than the adjacent surface of the substrate;
- and
- thereafter, processing the substrate to shape it into the desired product form.