High frequency signal transmission tape

A high frequency signal transmission tape for making an electrical connection to a high frequency IC chip comprising:

• a conductive signal line and two conductive grounding lines, said signal line and said grounding lines each having a rectangular cross-section with opposed first and second principal surfaces and first and second side wall surfaces transverse to the principal surfaces, said first principal surfaces of said signal line and said grounding lines lying in a plane with said signal line spaced from and disposed between said grounding lines;
• and
• a dielectric material disposed between and contacting said side wall surfaces of said signal line and said grounding lines, adhering said signal line to said grounding lines with said first and second principal surfaces exposed for bonding said signal line and said grounding lines to a high frequency IC chip.

A high frequency transmission tape for making an electrical connection to a high frequency IC chip comprising:

• a conductive signal line and two conductive grounding lines, said signal line and said grounding lines each having circular cross-sections with centers and outside surfaces, the centers of said signal line and said grounding lines lying in a plane with said signal line spaced from and disposed between said grounding lines;
• and
• a dielectric material disposed between and contacting parts of said outside surfaces of said signal line and said grounding lines, adhering said signal line to said grounding lines, said signal line and said grounding lines being commonly exposed along parts of the outside surfaces of said signal line and said grounding lines along a longitudinal direction of said tape generally parallel to said signal line and said grounding lines for bonding said signal line and said grounding lines to a high frequency IC chip.