Semiconductor device package having a sealing silicone gel with spherical fillers

A resin-sealed semiconductor device comprising:

• a board having a conductor pattern formed thereon;
• a semiconductor element including at least one soldering bump having a predetermined height facing said board and electrically bonded to said conductor pattern through said soldering bump;
• and
• a sealing resin entering a space between said semiconductor element and said board and sealing said semiconductor element;
• wherein said sealing resin includes
• a silicone gel as a base resin;
• and
• a spherical filler filled into said silicone gel, a diameter of said filler being at most a distance between said semiconductor element and said board, and volume percentage of said filler in said silicone gel being adjusted in such a way that a relationship between a coefficient .alpha. of linear expansion of said sealing resin and complex modulus of elasticity G* (dyn/cm.sup.2, at 1H.sub.z, 30.degree. C.) of said sealing resin meets retirement of following formula:
• .alpha..ltoreq.0. 033(G*-451).sup.-0.56.