High density vertically mounted semiconductor package

An electronic assembly comprising:

• a semiconductor chip mounted in a vertically mounted semiconductor chip package mechanically mounted to a printed circuit board and electrically connected to electrical connection lines on the printed circuit board, said vertically mounted semiconductor chip package comprising:
• (a) a body having first and second substantially parallel planar faces and a perimeter edge extending between first and second corners along which leads extend;
• (b) first and second supports formed on the first face near the edge, the first support near the first corner and the second support near the second corner;
• and
• (c) third and fourth supports formed on said second face near the edge, the third support near the first corner and the fourth support near the second corner, wherein the first support is staggered along the edge from the third support and the second support is staggered along the edge from the fourth support.

A semiconductor chip package comprising:

• a generally rectangular body having a generally rectangular first face, a generally rectangular second face parallel to the first face and substantially the same length and width as the first face, and a first edge between first and second corners of the first and second face;
• electrically conductive leads extending from the first edge;
• a first support on the first face near the first corner;
• a second support on the second face near the first corner and displaced along the edge from the first support;
• a third support on the first face near the second corner;
• a fourth support on the second face near the second corner and displaced along the edge from the third support, thereby forming a first pair of supports on the first face and a staggered pair of supports on the second face.