Package and method for assembly of infra-red imaging devices

A package for a semiconductor chip comprising:

• a body having an upper surface, a lower surface for holding a device, and a stepped, recessed peripheral portion including
• first and second shelves disposed between the upper and lower surfaces;
• electrical leads supported on one of said shelves;
• external electrical connectors supported by said body and electrically connected to said electrical leads;
• a semiconductor device held by said body and having bond pads disposed on a first surface thereof, generally aligned with the recessed peripheral portion of said body and electrically connected to said electrical leads;
• and wire connecting the bond pads on the chip to the electrical leads in the recess of the body.

In combination:

• a semiconductor chip with a first surface adapted to have light incident thereon and a second surface for supporting bond pads thereon;
• an adhesive tape contacting the second surface of the chip on substantially the entire surface except for the bond pads thereof;
• a body of alumina ceramic having upper and lower surfaces, the lower surface contacting the adhesive tape, the body having a peripheral portion with a recess therein and having electrical leads supported in said recess at a location proximate the bond pads of the chip;
• external electrical connectors disposed on the upper surface of the body and electrically coupled through the body to the electrical leads at the recess portion thereof and to the bond pads;
• and wire connecting the bond pads on the chip to the electrical leads in the recess of the body.

A method of packaging a semiconductor chip comprising the steps of:

• providing a body with a recess in the periphery thereof and having electrical leads supported in said recess;
• aligning a recess in a body with an adhesive tape;
• causing the body and the tape to come into contact so as to attach the body to the tape;
• aligning the recess int eh body to indicia on a chip having bonding pads;
• causing the tape and the semiconductor chip to come into contact so as to attach the tape to the semiconductor chip;
• curing the adhesive tape such that a mechanical and thermal bond is created between the semiconductor chip and the body;
• wire bonding the bonding pads on the chip and electrical leads in the recess of the body.