Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame

A semiconductor module, comprising:

• a lead frame member having an axis, said lead frame member including:
• first and second islands spaced apart from each other;
• and
• first, second, and third pluralities of leads extending parallel to said axis,
• said first and second pluralities of leads extending outward from, said first and second islands;
• and
• all of said third plurality of leads extending between said first and second islands;
• first and second semiconductor chips mounted on said first and second islands, respectively, at least one of said chips being connected to at least one of said third plurality of leads;
• and
• first and second resin bodies separately encapsulating said first and second semiconductor chips, respectively, and exposing said third plurality of leads.