Semiconductor infrared emitting device with oblique side surface with respect to the cleavage
AssigneeNEC Corporation
InventorTetsuro Kato
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AssigneeNEC Corporation
InventorTetsuro Kato
Estimating the term…
A semiconductor infrared emitting device is fabricated from an n-type gallium arsenide substrate, an n-type gallium arsenide layer on the top surface of the substrate, a p-type gallium arsenide layer formed on the n-type gallium arsenide layer for forming a p-n junction therebetween, and electrodes provided on the p-type gallium arsenide layer and the reverse surface of the substrate for applying a bias voltage to the p-n junction, and the side surface of the substrate declines from the cleavage surface of the gallium arsenide substrate so that the incident angle of infrared varies at the crystal surfaces, thereby allowing the infrared to be radiated from the semiconductor infrared emitting device.
A semiconductor infrared emitting device comprises:
Dependencies are inferred from the claim text.