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AssigneeFujitsu Limited
InventorsYasuo Yamagishi, Tamotsu Owada
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This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer and an insulating layer made of the insulating material for the wiring substrate on a rigid support substrate.
A method of producing a multi-layered wiring substrate comprising alternately laminating a wiring layer and an insulating layer made of insulating material on a rigid support substrate, said insulating material being a porous perfluorocarbon polymer film having void portion impregnated with a thermally set resin having a benzocyclobutene ring.
A method of forming holes of a wiring substrate for forming via holes in an insulating film of a multi-layered wiring substrate by utilizing ablation by an excimer laser beam, wherein said insulating film is prepared by allowing a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing an aromatic ring or hetero ring, and said excimer laser beam has a wavelength of not smaller than 190 nm and an emission time per pulse of at least 1 ns.
Dependencies are inferred from the claim text.