Removal of detrimental metal ions from hydrofluoric acid solution for cleaning silicon surfaces
AssigneeNEC Corporation
InventorsTsugio Shimono, Kenichi Yamamoto
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AssigneeNEC Corporation
InventorsTsugio Shimono, Kenichi Yamamoto
Estimating the term…
The invention relates to the removal of detrimental metal ions represented by Cu ion from a hydrofluoric acid solution for use in the manufacturing of semiconductor devices to clean silicon wafer surfaces. The acid solution is brought into contact with silicon granules which are used for the adsorption of the detrimental metal ions. To enhance the adsorption power and the rate of adsorption, the silicon granules are treated in advance to deposit a metal which is lower in ionization tendency than silicon on the surface of each silicon granule so as to partly cover the silicon granule surface by the deposited metal. Particularly Au or Ag is suitable as the metal deposited on the silicon granules.
In a method of refining a hydrofluoric acid solution for use in the manufacturing of semiconductor devices to clean silicon surfaces by removing at least one detrimental metal ion from the acid solution by bringing the acid solution into contact with silicon granules for adsorption of the detrimental metal ion or ions on the surfaces of the silicon granules,
In a method of refining a hydrofluoric acid solution for use in the manufacturing of semiconductor devices to clean silicon surfaces by removing at least one detrimental metal ion from the acid solution by bringing the acid solution into contact with silicon granules for adsorption of the detrimental metal ion or ions on the surfaces of the silicon granules,
In a method of refining a hydrofluoric acid solution for use in the manufacturing of semiconductor devices to clean silicon surfaces by removing at least one detrimental metal ion from the acid solution by bringing the acid solution into contact with silicon granules for adsorption of the detrimental metal ion or ions on the surfaces of the silicon granules,
In a method of refining a hydrofluoric acid solution for use in the manufacturing of semiconductor devices to clean silicon surfaces by removing at least one detrimental metal ion from the acid solution by bringing the acid solution into contact with silicon granules for adsorption of the detrimental metal ion or ions on the surfaces of the silicon granules,
Dependencies are inferred from the claim text.