Die paste transfer system and method

An apparatus for bonding an electronic die to a substrate comprising:

• transport means for transporting a die from a supply location past a paste station to a bonding site on a substrate;
• a paste station including a reservoir of bonding paste and a roller having a surface which rotates into and out of said reservoir to provide a second layer of bonding paste;
• a paste station for applying a first layer of bonding paste on a surface of said die as said dies moves through a second layer of bonding paste in said paste station;
• and
• control means, including control parameters for said transport means and said paste station wherein said parameters vary according to the die size, for implementing said parameters as a function of the bonding sequence of dies to move said transport means to pick up a die at said supply location, to move said die through said paste station and said second layer of bonding paste to provide a first layer of bonding paste on said surface of said die and to position said die surface having said first layer of bonding paste on said bonding site on said substrate.

An apparatus for bonding an electronic die to a substrate comprising:

• transport means for transporting a die from a supply location past a paste station to a bonding site on a substrate;
• a paste station for applying a first layer of bonding paste on a surface of said die as said dies moves through a second layer of bonding paste in said paste station;
• and
• control means for controlling said transport means to pick up a die at said supply location, to move said die through said paste station and said second layer of bonding paste while varying the height of said die as said die passes through said second layer to provide said first layer of bonding paste on said surface of said die and to position said die surface having said first layer of bonding paste on said bonding site on said substrate.

An apparatus for bonding an electronic die to a substrate comprising:

• transport means for transporting a die from a supply location past a paste station to a bonding site on a substrate;
• a paste station for applying a first layer of bonding paste on a surface of said die as said dies moves through a second layer of bonding paste in said paste station;
• shearing means for producing shear in said second layer of bonding;
• and
• control means for controlling said transport means to pick up a die at said supply location, to move said die through said paste station and said second layer of bonding paste to provide said first layer of bonding paste on said surface of said die and to position said die surface having said first layer of bonding paste on said bonding site on said substrate.