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US 5,348,214 AGranted
Method of mounting semiconductor elements
AssigneeSumitomo Electric Industries, Ltd.
InventorsMasanori Nishiguchi, Atsushi Miki
Life of this patent
Estimating the term…
Abstract
A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.
Claims2
A method of mounting semiconductor elements comprising the steps of:
- providing a plurality of semiconductor elements, each of said semiconductor elements having first and second surfaces and having bump electrodes on said first surface;
- forming a resist pattern on heat sinks to align said semiconductor elements with said heat sinks;
- joining said heat sinks to said second surfaces;
- pressing said semiconductor elements, with said heat sinks joined thereon to a wiring board having electrodes, while aligning said bump electrodes to correspond with the wiring board electrodes;
- heating said bump electrodes and said wiring board to mount said semiconductor elements on said wiring board;
- and
- applying a molding resin to said wiring board, said semiconductor elements and said heat sinks.
4 more elements
Dependencies are inferred from the claim text.