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US 5,347,362 AGranted
Bonding wire inspection method
AssigneeKabushiki Kaisha Shinkawa
InventorKenji Sugawara
Life of this patent
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Abstract
A method of inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame taking the steps of: bringing the focus of an optical assembly into a desired point of a bonded wire, thus obtaining the height of such a desired point of the wire as a reference; photographing an image of the wire at the reference height; and then obtaining the height of the wire based upon the amount of the indistinct image of the photographed wire.
Claims3
A method of inspecting wires bonded between pads of a semiconductor chip and leads of a lead frame, said method comprising the steps of:
- moving a single optical means in a Z direction to focus said single optical means onto a surface of a semiconductor chip with a desired lead and desired bonding wire within an image field of said single optical means, said single optical means comprising a low magnification camera with a shallow depth of focus;
- photographing an indistinct image of said desired bonding wire;
- measuring a width of said indistinct image of said desired bonding wire;
- moving said single optical means in said Z direction to focus said single optical means onto a lead;
- photographing an indistinct image of said desired bonding wire;
- measuring a width of said indistinct image of said desired bonding wire;
- and
- calculating a height of said desired bonding wire from said measured widths of said indistinct image of said desired bonding wire when said single optical means is focused on said surface of said semiconductor chip and focused onto said lead;
- whereby a more precise measurement of the height of said bonding wire is made.
6 more elements
Dependencies are inferred from the claim text.