Multilayer circuit card connector

A multilayer circuit card connector for electrically interconnecting a first electronic module to a second electronic module comprising:

• a rigid nitride ceramic core of electrically insulative characteristic and thermally conductive characteristic with a thermal expansion characteristic similar to said first and second electronic modules;
• a first electrical via extending from a first surface of said core to a second surface of said core, said electrical via being electrically conductive;
• a first rigid laminate of a first electrically insulative oxide layer and a second electrically insulative oxide layer and a wiring pattern therebetween, said first rigid laminate bonded to said core on said first surface thereof, said first rigid laminate further comprising a first laminate electrical via electrically coupling between a first laminate surface opposite said core and said first electrical via;
• a second rigid laminate of a first electrically insulative oxide layer and a second electrically insulative oxide layer and a wiring pattern therebetween, said second rigid laminate bonded to said core on said second surface thereof, said second rigid laminate further comprising second laminate electrical vias electrically coupling between a first laminate surface of said second rigid laminate opposite said core and said first electrical via;
• and
• means for thermally and electrically connecting said first electronic module to said first rigid laminate and means for thermally and electrically connecting said second electronic module to said second rigid laminate, whereby said first and said second electronic modules are electrically interconnected.