Coaxial die and substrate bumps
AssigneeMicroelectronics and Computer Technology Corporation
InventorsCurtis N. Potter, David A. Gibson, Uttam S. Ghoshal
Life of this patent
Estimating the term…
Abstract
A coaxial bump for connecting a die to a substrate includes a center post and a ground ring surrounding and shielding the center post. The center post may be a center conductor line, and the ground ring may be generally torus-shaped, nearly closed or completely closed. The coaxial bump provides very low crosstalk in chip-to-substrate interconnections and provides a constant impedance with negligible inductive discontinuity.
Claims18
A coaxial bump for connecting a die to a substrate, said coaxial bump comprising:
- a center conductor line;
- and
- a ground ring spaced from and surrounding said center conductor line wherein said ground ring provides said center conductor line with electromagnetic shielding from adjacent signal bumps thereby permitting only a very low level of crosstalk between said center conductor line and said adjacent signal bumps.
A coaxial bump comprising:
- a dielectric layer;
- a passivation layer;
- a ground layer disposed between said dielectric layer and said passivation layer;
- an inner bump center conductor extending through and electrically isolated from said ground layer;
- and
- an outer bump shield mounted atop and electrically connected to said ground layer.
A coaxial bump for connecting a die to a substrate, said bump comprising:
- a center conductor line;
- and
- a ground ring with at least one gap therein, said ground ring spaced from and partially surrounding said center conductor line wherein said ground ring provides said center conductor line with electromagnetic shielding from adjacent signal bumps thereby reducing crosstalk between said center conductor line and said adjacent signal bumps.
Dependencies are inferred from the claim text.