Water curable resin compositions

A water-curable polymer solution comprising:

• (a) about 40-60 wt-% of a water-reactive liquid organometallic compound having the formula (R.sup.1 O).sub.x MR.sup.2.sub.(y-x) wherein:
• (i) each R.sup.1 is independently a substituted or unsubstituted C.sub.1 -C.sub.100 hydrocarbon group, optionally interrupted in the backbone by 1--10 nonperoxide --0--, --S--, --C(O)--, or --N-- groups;
• (ii) each R.sup.2 is independently selected from the group consisting of hydrogen and a substituted or unsubstituted C.sub.1 -C.sub.100 hydrocarbon group, optionally interrupted in the backbone by 1--10 nonperoxide --0--, --S--, --C(O)--, or --N-- groups;
• (iii) x is an integer between 1 and y, inclusive;
• (iv) y is the valence of M;
• (v) M is selected from the group consisting of boron, aluminum, silicon, and titanium;
• and
• (b) about 40-60 wt-% of a nonreactive organic thermoplastic nonether-containing condensation polymer, having a number average molecular weight of at least about 1,000, dissolved within the water-reactive liquid organometallic compound;
• wherein the polymer solution is stable at a temperature of about 0.degree.-100.degree. C. and is capable of curing upon exposure to water to form a composite material at a temperature of about 10.degree.-100.degree. C.

A water-curable resin composition comprising:

• (a) a water-reactive liquid organometallic compound having at least one hydrolyzable group per molecule;
• and
• (b) a nonreactive organic thermoplastic addition polymer, having a number average molecular weight of at least about 1,000, mixed with the water-reactive liquid organometallic compound;
• wherein the resin composition is stable at a temperature of about 0.degree.-100.degree. C. and is capable of curing upon exposure to water to form a composite material at a temperature of about 10.degree.-100.degree. C.