Method for forming a flip-chip bond from a gold-tin eutectic
AssigneeMotorola, Inc.
InventorsThomas A. Scharr, Russell T. Lee, Ravichandran Subrahmanyan
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Abstract
A method for flip-chip bonding an integrated circuit die to a substrate. A substrate (21) having conductive bonding areas (22) coated with tin (23) is secured to a bottom end effector of a flip-chip bonding apparatus. An integrated circuit die (26) having gold bumps (28) is secured to a die tool of the flip-chip bonding apparatus. A gold-tin eutectic bond is formed between the integrated circuit die (26) and the conductive bonding areas (22) of the substrate (21).
Claims12
A method for forming a flip-chip bond from a gold-tin eutectic, comprising the steps of:
- providing a semiconductor integrated circuit having at least one gold bump;
- providing a substrate having at least one conductive bonding area, the at least one conductive bonding area coated with tin;
- and
- flip-chip bonding the at least one gold bump with the at least one conductive bonding area to form the gold-tin eutectic.
A flip-chip method for bonding a semiconductor integrated circuit to a circuit board, comprising the steps of:
- providing a semiconductor integrated circuit having a plurality of gold bumps;
- providing a circuit board having a plurality of bonding areas, the plurality of bonding areas coated with tin and patterned to mate with the plurality of gold bumps;
- flip-chip bonding the plurality of gold bumps with the plurality of bonding areas wherein the step of flip-chip bonding forms a gold-tin eutectic.
Dependencies are inferred from the claim text.