Cover tape for packaging chip type electronic parts

A cover tape for packaging of chip type electronic parts which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts comprising an outer layer, an intermediate layer and an inner layer;

• said outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon, said outer layer having a thickness of from 6 to 100 .mu.m;
• said intermediate layer consists of a polyolefin selected from the group consisting of polyethylene, ethylenevinyl acetate copolymer, ionomer, and polypropylene, said intermediate layer having a thickness of 10 .mu.m or more;
• said adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders selected from the group consisting of tin oxide, zinc oxide, titanium oxide, a silicon-based organic compound, and combinations thereof said adhesion layer having a thickness of 5 .mu.m or less;
• wherein the amount of the conductive fine powders is from 10-100 parts by weight per 100 parts by weight of the thermoplastic resin of the adhesion layer and the surface resistance of the adhesion layer is 10.sup.13 ohms per square or less;
• the interlaminar adhesion strength between the intermediate layer and the adhesion layer is 10-120 g/mm of sealing width;
• the visible light transmittance of the cover tape is 10% or more.