Electronic package using closed pore composites
AssigneeW. R. Grace & Co.-Conn.
InventorsJohn W. Lau, Jack H. Enloe
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Abstract
The electronic packages of the invention all employ the general materials scheme of a low dielectric constant material (low K material) mounted on a dense, high thermal conductivity (high TC) ceramic base. In this way, the low K material provides the signal transmission paths to and from the I.C. chips housed in the package and thus allows for higher signal transmission speed. The high TC material allows for heat dissipation out of the package. The dense base and/or the low K material may contain metallization in any desired pattern. The low K material is preferably a composite of closed pores in a glass-containing matrix.
Claims13
An electronic package comprising a thermally conductive substrate, having a thermal conductivity of at least about 0.70 W/cm-k, and a first low dielectric constant layer, having a dielectric constant of about 3.0 or less, laminated onto said substrate, a first side of said layer and said substrate defining a layer-substrate interface, and said layer comprising a closed pore composite of 55-60 vol. % hollow glass microspheres in a glass containing matrix.
Dependencies are inferred from the claim text.