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US 5,346,747 AGranted
Composite printed circuit board substrate and process for its manufacture
AssigneeGranmont, Inc.
InventorsVincent M. Vancho, Hak H. Wu, Yutao Ma, Erik L. Jorgensen
Life of this patent
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Abstract
Composite printed circuit board substrates having fiber reinforcement in a polymer matrix are disclosed. The fibers may be thermotropic melt processable liquid crystal polymer fibers.
Claims6
A composite printed circuit board substrate having a fibre reinforcement and a polymer matrix, wherein the fibre reinforcement comprises thermotropic melt processable liquid crystal polymer (LCP) fibres.
A printed circuit board comprising:
- a) a substrate sheet comprising reinforcement made of thermotropic melt processable LCP fibres and a thermoset resin, and
- b) at least one layer of metal laminated onto the substrate.
Dependencies are inferred from the claim text.