Palladium thick film resistor containing boron nitride
AssigneeMotorola, Inc.
InventorsJames H. Lombard, Leonard J. Anderson
Life of this patent
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Abstract
An electrically resistive film of the type used for forming thick film resistors is formed predominantly of palladium and includes an addition of boron nitride to increase resistance, preferably in combination with tantalum oxide. A paste of palladium powder and boron nitride powder dispersed in a vaporizable vehicle is applied to a substrate and sintered to form the film. In a preferred embodiment, the substrate is a ceramic powder compact that is concurrently sintered in a co-firing process.
Claims16
A process for forming an electrical resistive, sintered palladium film onto a refractory substrate, said process comprising
- applying a paste onto the substrate to form a particulate layer, said paste being composed of a mixture of powders dispersed in a vaporizable liquid vehicle, said mixture being composed predominantly of sinterable palladium powder and comprising a boron nitride powder and a tantalum oxide powder and
- heating the particulate layer to a temperature effective to sinter the palladium powder to form an integral film comprising a first dispersed phase derived from said boron nitride powder and a second dispersed phase derived from said tantalum oxide powder.
A process for forming an electrically resistive, sintered palladium film onto a ceramic substrate, said process comprising
- applying a paste on the substrate, said paste being composed of a mixture of powders dispersed in a vaporizable liquid vehicle, said mixture comprising between about 1 and 15 weight percent boron nitride powder between about 2.5 and 7.0 weight percent tantalum oxide powder and the balance predominantly sinterable palladium powder, said vehicle including an expendable organic binder,
- drying the applied paste to form a particulate layer, and
- heating the particulate layer to a temperature effective to sinter the palladium powder to form an integral film.
A process for forming an electrically resistive, sintered palladium film onto a ceramic substrate, said process comprising
- applying a paste to the substrate, said paste being composed of a mixture of powders dispersed in a vaporizable liquid vehicle, said mixture consisting essentially of between about 1 and 15 weight percent boron nitride powder, between about 2.5 and 7.0 weight percent tantalum oxide powder, up to about 3 weight percent silver powder, up to about 2.5 weight percent calcium oxide borosilicate glass powder, up to about 5 weight percent alkaline earth titanate powder, and the balance palladium powder, said vehicle containing an expendable organic binder,
- drying the applied paste to form a particulate layer composed of said powders bonded by said expendable organic binder, and
- heating the particulate layer to a temperature between about 1000.degree. C. and 1400.degree. C., whereupon the binder decomposes and the palladium powder is sintered to form an integral film.
A co-firing process for forming an electrically resistive, sintered palladium film onto a substrate, said process comprising
- applying a paste to a compact composed of a ceramic powder, said paste being composed of a mixture of powders dispersed in a vaporizable liquid vehicle, said mixture comprising a boron nitride powder, a tantalum oxide powder, and the balance predominantly a sinterable palladium powder,
- drying the applied paste to form a particulate layer, and
- heating the particulate layer and the compact to a temperature effective to sinter the ceramic powder to form an integral substrate and to sinter the palladium powder to form an integral film bonded to the substrate, said film comprising a first dispersed phase derived from said boron nitride powder and a second dispersed phase derived from said tantalum oxide powder.
A co-firing process for forming an electrically resistive, sintered palladium film onto a ceramic substrate, said process comprising
- applying a paste to a compact formed of ceramic powder composed of an alkaline earth metal titanate compound and bonded by an expendable organic binder, said paste being composed of a mixture of powders dispersed in a vaporizable liquid vehicle containing an expendable organic binder, said mixture comprising between about 1 and 15 weight percent boron nitride powder, between about 2.5 and 7.0 weight percent tantalum oxide powder, and the balance predominantly palladium powder,
- drying the applied paste to form a particulate layer composed of the mixture bonded by the expendable organic binder, and
- heating the particulate layer and the compact to a temperature between 1000.degree. C. and 1400.degree. C. to sinter the ceramic powder to form an integral substrate and to sinter the particulate layer to from an integral film bonded to the substrate.
A co-firing process for forming an electrically resistive, sintered palladium film onto a ceramic substrate, said process comprising
- applying a paste to a compact formed of ceramic powder composed of an alkaline earth metal titanate compound and bonded by an expendable organic binder, said paste being composed of a mixture of powders dispersed in a vaporizable liquid vehicle containing an expendable organic binder, said mixture consisting essentially of between about 1 and 15 weight percent boron nitride powder, between about 2.5 and 7.0 weight percent tantalum oxide powder, up to about 3 weight percent silver powder, up to about 2.5 weight percent calcium borosilicate glass powder, up to about 5 weight percent alkaline earth metal titanate powder, and the balance palladium powder,
- drying the applied paste to form a particulate layer, and
- heating the compact and the particulate layer to a temperature between about 1285.degree. C. and 1320.degree. C. to decompose the organic binders, to sinter the ceramic powder to form an integral substrate and to sinter the palladium powder to from an integral film bonded to the substrate.
Dependencies are inferred from the claim text.