Method of manufacturing IC card

A method of manufacturing an IC card comprising:

• forming through holes in a plurality of core sheets;
• providing a core sheet without a hole;
• stacking the core sheets with through holes in sequence on the core sheet without a hole to form an opening defined by the through holes, and the core sheet without a hole, including placing at least one adhesive layer between and contacting at least two adjacent core sheets at the periphery of the through holes leaving adhesive-free areas between the core sheets remote from the opening;
• placing an IC module into the opening, a gap being formed between the opening and the IC module;
• and
• applying heat and pressure to the core sheets, at least one adhesive layer, and IC module, wherein the gap between said IC module and said core sheets is filled by flow of the adhesive layer while applying heat and pressure.