Lathing and cleaning process for photoreceptor substrates

A method of cleaning a substrate comprising:

• (1) lathing a substrate with a cutting fluid composition comprising:
• (A) about 1 part by weight of triethanolamine;
• (B) about 2 parts by weight of octylphenoxy polyethoxyethanol;
• (C) about 10 parts by weight of polyethylene glycol;
• and
• (D) about 87 parts by weight of deionized water;
• (2) spray rinsing the substrate at a pressure of about 50 psi for about 1 minute with deionized water having a resistivity of greater than about 2M ohm-cm;
• (3) immersing the rinsed lathed substrate surface in a bath of deionized water having a resistivity of at least 2M ohm-cm for about 1 minute;
• and
• (4) removing the substrate from the bath of deionized water at a rate of less than about 2.5 centimeters per second.

A method of cleaning a substrate comprising:

• (1) lathing a substrate with a cutting fluid composition comprising:
• (A) about 2.5 parts by weight of an antioxidant containing an amine borate, propylene glycol, amine carboxylate, a non-ionic surfactant, and a non-silicone anti-foaming agent;
• (B) about 1 part by weight of octylphenoxy polyethoxyethanol;
• (C) about 2 parts by weight of polyethylene glycol;
• and
• (D) about 94.5 parts by weight of deionized water;
• (2) rinsing the lathed substrate surface with deionized water having a resistivity of at least 2M ohm-cm;
• (3) immersing the rinsed lathed substrate surface in a bath of deionized water having a resistivity of at least 2M ohm-cm;
• and
• (4) removing the substrate from the bath of deionized water at a rate which prevents water droplets from forming on the substrate.