Device for thermal treatment and film forming process

A device for a thermal treatment process and a film forming process comprising:

• a film forming process chamber for forming a film on a semiconductor substrate under high temperatures;
• heating means, positioned to enclose the outer periphery of said film forming process chamber, for heating the inside of said film forming process chamber to a high temperature;
• and
• insulating means positioned to enclose the outer periphery of said heating means;
• a first space is formed between said film forming process chamber and said heating means;
• a second space is formed between said heating means and said insulating member, said first space being isolated from said second space;
• first exhaust means is provided for exhausting air from within said first space;
• and
• second exhaust means is provided for exhausting air from within said second space,
• wherein
• prior to inserting the semiconductor substrate into and removing the semiconductor substrate from said film forming process chamber, high temperature air is exhausted from said first space and said second space by said first exhaust means and said second exhaust means, respectively, in order to cool inside of said film forming process chamber.