Method of manufacturing a printed wiring board
OwnerYoshitaka Saitohinventor
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Abstract
A method of manufacturing a printed wiring board is disclosed. The method comprises the steps of forming a printed circuit on a substrate, coating an insulating layer on at least a part of the printed circuit, coating a shield layer on at least a part of the insulating layer, and forming the shield layer by a halftone dot.
Claims6
A method of manufacturing a printed wiring board which comprises the steps of forming a printed circuit on a substrate, coating an insulating layer on at least a part of the printed circuit, and coating a shield layer on at least a part of the insulating layer by applying a pattern of halftone dots.
A method of producing a printed circuit board, comprising:
- forming a circuit on a substrate;
- covering at least a portion of the circuit with an insulating layer;
- and
- applying a shield layer of halftone dots on at least a portion of the insulating layer.
Dependencies are inferred from the claim text.