Method for detecting MIS-orientation of semiconductor packages

A method for detecting mis-orientation in a semiconductor package, comprising the steps of:

• providing a semiconductor package having a waste portion that is discarded during package processing, wherein the waste portion has
• a lower surface and a cavity extending from the lower surface into the waste portion of the semiconductor package;
• positioning the semiconductor package in a travel path of a packaging process apparatus;
• providing an orientation support plate having an upper surface facing the lower surface of the waste portion of the semiconductor package;
• providing a protrusion extending upward from the upper surface of the orientation support plate, the protrusion is for mating with the cavity in the semiconductor package;
• moving the orientation support plate towards the travel path so that the protrusion extends above the lower surface of the waste portion of the semiconductor package when the protrusion mates with the cavity and the semiconductor package is properly oriented on the travel path, and the protrusion contacts the waste portion when the semiconductor package is mis-oriented on the travel path, the semiconductor package remaining in the travel path when the semiconductor package is properly oriented and a portion of the semiconductor package being moved off the travel path when the semiconductor package is mis-oriented.