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US 5,345,205 AGranted
Compact high density interconnected microwave system
AssigneeGeneral Electric Company
InventorWilliam P. Kornrumpf
Life of this patent
Estimating the term…
Abstract
A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the interconnect structure on appropriate sized mandrels between the modules to place the modules in a multi-tier physical stack. Shielding and hermetic packaging may also be provided.
Claims26
A microwave system comprising:
- a plurality of distinct microwave electronic modules with respective electrical contacts thereon;
- a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer;
- said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers.
A microwave system comprising:
- a plurality of distinct microwave electronic modules with respective electrical contacts thereon;
- a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and flexible conductors supported by said dielectric layer which are ohmically connected to said respective electrical contacts of said microwave electronic modules;
- said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers;
- a first flexible support member bonded to said flexible high density interconnect structure at a bend in said high density interconnect structure;
- a second flexible support member bonded to the opposite side of said structure from said electronic modules;
- said second flexible support member being disposed at another bend in said flexible high density interconnect structure, said flexible high density interconnect structure at said another bend having an inside facing radially inwardly and an outside facing radially outwardly;
- and
- said second flexible support member being disposed on the outside of said high density interconnect structure at said another bend.
5 more elements
A microwave system comprising:
- a plurality of distinct microwave electronic modules with respective electrical contacts thereon;
- a flexible high density interconnect structure interconnecting said microwave electronic modules, said flexible high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer;
- said microwave electronic modules being disposed in a multi-tier stack by having said flexible high density interconnect structure being bent between adjacent tiers;
- a support mandrel having a curved surface;
- and
- a portion of said flexible high density interconnect structure being disposed in contact with said curved surface where said flexible high density interconnect structure is bent between two adjacent ones of said modules.
3 more elements
A method of assembling a microwave system comprising:
- providing a plurality of components;
- arranging said components in groups on a support structure, each of said groups comprising the components of a different microwave electronic module;
- physically and electrically interconnecting said components with a high density interconnect structure including a dielectric layer having a side which is bonded to at least two of said microwave electronic modules and including flexible conductors on an opposite side of said dielectric layer supported by said dielectric layer and ohmically connected to said respective electrical contacts of said microwave electronic modules through via holes in said dielectric layer;
- rendering a portion of said high density interconnect structure disposed between two adjacent ones of said microwave electronic modules flexible;
- and
- bending said flexible portion of said high density interconnect structure to place said two adjacent ones of said microwave electronic modules in a stack.
3 more elements
Dependencies are inferred from the claim text.