Cooling apparatus for electronic device

A cooling apparatus for an electronic device with a heat transfer surface, comprising a cooling solid body, a spring which forces the cooling solid body into close contact with the heat transfer surface of the electronic device to which surface is applied a highly viscous fluid layer containing thermal conductive powder with high thermal conductivity hardly wetting body, and said spring presses the highly viscous fluid layer constantly to keep the fluid layer as a thin layer, wherein one of a heat transfer surface of the electronic device and the heat transfer surface of the cooling solid body is flat, the other heat transfer surface is a grooved surface including flat heat transfer surface portions and multiple grooves defined between the flat heat transfer surface portions and communicates with an outside of one of said electronic device and said cooling solid body having the grooved heat transfer surface, and the capacity of each of the grooves is larger than the volume of a portion of the highly viscous fluid layer applied to a corresponding flat heat transfer surface portion between adjacent ones of the grooves.

A cooling apparatus for an electronic device, comprising a cooling solid body in close contact through a highly viscous fluid layer containing thermal conductive powder and having a high thermal conductivity with a heat transfer surface of the electronic device, and multiple grooves which are formed on one of the heat transfer surface of said electronic device and the heat transfer surface of said cooling solid body and which are communicated with the outside of the heat transfer surface, the capacity of said grooves is greater than the volume of the highly viscous fluid layer sandwiched between said heat transfer surfaces, and each of the grooves leaves therein space communicating with an outside of the heat transfer surface when the highly viscous fluid layer is received within said grooves, and an elastic member is provided for pressing to force said cooling solid body into close contact with the electronic device and for pressing the highly viscous fluid layer constantly to keep the fluid layer as a thin layer.

A cooling apparatus for an electronic device, comprising a multichip module package made of a high thermal conductive material to seal a ceramic multilayer interconnection substrate with multiple LSI chips packaged thereon and flexible thermal conductive contactors to transmit heat produced by said LSI chips to said package;

• multiple grooves provided on at least one of contact surfaces between heat transfer surfaces of said LSI chips and heat transfer surfaces of said flexible thermal conductive contactors;
• a highly viscous fluid layer containing thermal conductive powder sandwiched between said contact surfaces;
• and an elastic member operatively arranged for forcing said flexible thermal conductive contactors into close contact with the heat transfer surfaces of said LSI chips and for pressing said highly viscous fluid layer constantly to keep the fluid layer as a thin layer.

A cooling apparatus for an electronic device, comprising a multichip module package made of a high thermal conductive material to seal a ceramic multilayer interconnection substrate with multiple microchip carriers containing LSI chips packaged thereon and flexible thermal conductive contactors to transmit heat produced by said LSI chips to said package;

• multiple grooves provided on one of contact surfaces between heat transfer surface of said microchip carriers and said flexible thermal conductive contactors;
• a highly viscous fluid layer containing thermal conductive powder sandwiched between the two contact surfaces;
• and an elastic member operatively arranged for forcing said flexible thermal conductive contactors into close contact with the heat transfer surface of said microchip carriers and for pressing said highly viscous fluid layer constantly to keep the fluid layer as a thin layer.