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US 5,345,057 AGranted
Method of cutting an aperture in a device by means of a laser beam
AssigneeLasag AG
InventorFritz Muller
Life of this patent
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AssigneeLasag AG
InventorFritz Muller
Estimating the term…
The invention relates to a method of cutting an aperture in a device (1) by means of a laser beam (9), said device comprising a wall (2) having first (5) and second (6) opposing surfaces, and a third surface (7) separated from said wall (2) along the path (11) of said laser beam (9), said method comprising the steps of: (a) causing said laser beam (9) to be incident upon said first surface (10) so as to cut through said wall (2) and form said aperture, and (b) introducing fluid between said second (6) and third (7) surfaces in the path (11) of said laser beam (9) so as to thereby prevent damage to said third surface (7) when said laser beam has cut through said wall. The invention may be used to cut aperture in devices such as injector nozzles syringe needles, medical stents and fluid/air control valves.
A method of cutting an aperture in a device by means of a laser beam, said device comprising a first surface, a bore extending partially through said device and defining a second surface opposed to said first surface, and a third surface separated from said second surface along the path of said laser beam, said bore having an open end and a closed end, and said method comprising the steps of:
Dependencies are inferred from the claim text.