Method for encapsulating an integrated circuit using a removable heatsink support block

A method of making an encapsulated integrated circuit chip having a heat exchanger, comprising,

• providing an integrated circuit structure which includes an integrated circuit chip on a substrate, the chip electrically connected to a plurality of leads extending from the substrate;
• preforming a removable seal and support block supporting a plurality of spaced thermally conductive heat exchanger elements having first and second ends, said support block engaging and supporting the second ends of the heat exchanger elements while leaving the first ends exposed;
• inserting the support block in a mold cavity such that the support block is spaced from the integrated circuit structure and the first ends of the heat exchanger elements are positioned adjacent to the integrated circuit structure;
• molding a non-electrically conductive thermosetting or thermoplastic material to form a housing in the mold cavity enclosing the chip and the first ends of the heat exchanger elements while allowing the second ends of the heat exchanger elements to be exposed to the exterior of the housing;
• and
• removing the support block from the second ends of the heat exchanger elements.