Method of making a semiconductor chip
AssigneeSiemens Components, Inc.
InventorsDavid Whitney, Lynn Wiese
Life of this patent
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AssigneeSiemens Components, Inc.
InventorsDavid Whitney, Lynn Wiese
Estimating the term…
An optically-triggered silicon controlled rectifier (SCR) device (21) mounted on a lead frame (34). The SCR device contains a cathode layer (24), an optical gate or control layer (23), and an anode layer (31) formed on a semiconductor substrate (22). The device is soldered onto a pedestal (33) formed on the lead frame. To connect the device to the lead frame, solder is deposited upon the anode layer and the solder fixes the anode layer to the pedestal on the lead frame. The pedestal may be formed by etching or stamping a depression (35) in the lead frame. The device is centered on the pedestal such that the edges of the device are located adjacent the depression, and are spaced from the lead frame.
A method of fabricating a semiconductor chip comprising:
A method of fabricating an optically-triggered silicon controlled rectifier (SCR) device comprising:
Dependencies are inferred from the claim text.