Filler for heat-conductive plastics materials
AssigneeCiba-Geigy Corporation
InventorsPatrice Bujard, Ileana Cojanu
Life of this patent
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Abstract
A powder mixture of aluminium nitride in the form of sintered agglomerates with fractions of different particle size, which mixture comprises (1) 80 to 50% by weight of aluminium nitride in the form of sintered agglomerates having a mean particle diameter of 30 to 50 .mu.m, and (2) 20 to 50% by weight of aluminium nitride in the form of unsintered particles and having a mean particle diameter of 0.1 to 5 .mu.m. The mixture is suitable for use as filler for polymer materials, especially for casting resins, from which moulded parts of high thermal conductivity can be fabricated, for example potted electronic components.
Claims9
A powder mixture of aluminium nitride in the form of sintered agglomerates with fractions of different particle size, which mixture consists essentially of
- (1) 80 to 50% by weight of aluminium nitride in the form of sintered agglomerates having a mean particle diameter of 30 to 50 .mu.m, and
- (2) 20 to 50% by weight of aluminium nitride in the form of unsintered particles and having a mean particle diameter of 0.1 to 5 .mu.m.
Dependencies are inferred from the claim text.