Method of manufacturing a pointed electrode, and device for using said method
AssigneeU.S. Philips Corporation
InventorsRemko Horne, Cornelius A. Van Den Heuvel, Gerardus N. A. Van Veen
Life of this patent
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Abstract
The manufacture of pointed electrodes (28) (field emitters) is considerably simplified by a directed sputtering deposition instead of by vapor deposition. Directed deposition of the material (12) to be sputtered can be effected by means of a collimating filter (4) and, if necessary, a cover plate (8).
Claims9
A method of manufacturing, on a substrate, at least one electrode whose cross-section parallel to a main surface of the substrate is larger at the base than at the top, the method comprising depositing material for forming the electrode on an apertured mask parallel to a main surface of the substrate and on the substrate via the aperture, the material on the mask also growing in a lateral direction within the aperture during deposition, characterized in that the deposition is at least partially carried out by sputtering in a direction substantially perpendicular to the main surface of the substrate.
Dependencies are inferred from the claim text.