Method of making high density self-aligning conductive networks and contact clusters
AssigneeRock Ltd.
InventorJoseph A. Roberts
Life of this patent
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Abstract
A conductive network, which can be flexible or rigid, can have self-aligning conductors which connect with corresponding conductors of other networks. The conductive network can be fabricated into densely packed contact clusters for use as electrical interconnectors or circuits. The contact clusters, which can be configured to substantially any shape, are the essential components of high density connector assemblies. The methods and apparatus for making the conductive network and cluster contacts are also described.
Claims50
A method for manufacturing a conductive network comprising the steps of
- forming a planar metallic sheet into a non-planar pattern having
- a dielectric material on a first side of said metallic sheet;
- and
- removing raised portions of said metallic sheet from a second side of said metallic sheet to form electrically insulated conductive paths.
A method for fabricating an interconnection between two conductive materials comprising the steps of:
- forming a planar metallic sheet into a non-planar pattern;
- adhering a flexible dielectric material to a first side of said metallic sheet;
- removing raised portions of said metallic sheet from a second side of said metallic sheet to form electrically insulated conductive paths;
- providing at least one window in an insulating layer;
- adhering a conductive sheet material to said insulating layer;
- and
- cold pressure fusing a conductive path and said conductive sheet through said insulating layer window.
A method for manufacturing a conductive network comprising the steps of
- forming a planar metallic sheet into a non-planar pattern;
- adhering a dielectric material to a first side of said metallic sheet;
- removing raised portions of said metallic sheet from a second side of said metallic sheet to form electrically insulated recessed conductive paths;
- and
- blocking at least one of said conductive paths to isolate at least one pad portion of a path for receiving a solder volume.
A method for manufacturing a conductive network comprising the steps of
- forming a planar metallic sheet into a non-planar pattern;
- adhering a dielectric material to a first side of said metallic sheet;
- removing raised portions of said metallic sheet from a second side of said metallic sheet to form electrically insulated recessed conductive paths;
- and
- providing at least one of said conductive paths with a solder volume at a portion thereof.
A method for manufacturing a conductive network comprising the steps of
- forming an electrically conducting material into a non-planar pattern;
- adhering a dielectric material to a first side of said material;
- and
- removing raised portions of said conducting material from a second side of said conducting material to form electrically insulated conductive paths.
A method for manufacturing a supported conductive network comprising the steps of:
- a) forming a planar electrically conductive sheet into a non-planar pattern having a dielectric material fast with a first face thereof;
- and
- b) removing portions of the sheet from a second face thereof to form electrically insulated electrically conductive paths supported by the dielectric material.
A method for manufacturing a supported conductive network comprising the steps of:
- a) providing a flexible laminate having an electrically conductive layer and a dielectric layer, the laminate being sufficiently pliable to be deformed by a partial vacuum to define a non-planar pattern;
- b) applying such a partial vacuum to the dielectric layer to draw a first face of the laminate against an appropriately contoured surface forming the laminate into a non-planar pattern;
- and
- c) removing portions of the laminate from a second face thereof to form electrically insulated electrically conductive paths supported by the dielectric material.
A method for manufacturing a supported conductive network comprising the steps of:
- a) providing a planar electrically conductive sheet
- b) forming a non-planar pattern in said planar electrically conductive sheet, and providing a dielectric material fast with a first face of said sheet;
- c) removing portions of the sheet from a second face thereof to form electrically insulated electrically conductive recessed paths supported by the dielectric material;
- and
- d) blocking at least one of said recessed conductive paths to isolate at least one pad portion of a path for receiving a solder volume.
A method for manufacturing a supported conductive network comprising the steps of:
- a) providing a planar electrically conductive sheet
- b) forming a non-planar pattern in said planar electrically conductive sheet, and providing a dielectric material fast with a first face of said sheet;
- c) removing portions of the sheet from a second face thereof to form a plurality of electrically insulated electrically conductive recessed paths supported by the dielectric material;
- d) providing a spring layer overlapping at least a portion of said dielectric layer;
- e) shaping a first end of said conductive paths to form a contact region having at least one pair of parallel, spaced apart, clip arms oriented parallel to a common axis;
- f) orienting a second end of said conductive paths to form a clip member for mechanically interlocking with conductive contacts of a connecting member;
- g) providing connection of one or more circuit elements to selected conductive paths in a circuit configuration.
A method for manufacturing a supported conductive network comprising the steps of:
- a) providing a planar electrically conductive sheet;
- b) forming a non-planar pattern in said planar electrically conductive sheet, and providing a dielectric material fast with a first face of said sheet, wherein the forming step and application of the dielectric material are performed simultaneously by molding the dielectric material onto the first face with the molding pressure serving to deform the planar sheet into the non-planar pattern;
- and
- c) removing portions of the sheet from a second face thereof to form electrically insulated electrically conductive paths supported by the dielectric material.
A method for manufacturing a supported conductive network comprising the steps of:
- a) providing a planar electrically conductive sheet;
- b) forming a non-planar pattern in said planar electrically conductive sheet, and providing a dielectric material fast with a first face of said sheet;
- c) removing portions of the sheet from a second face thereof to form electrically insulated electrically conductive paths supported by the dielectric material;
- d) making fast a second electrically conductive material to the dielectric material remote from the paths;
- and
- e) providing a window in said dielectric material and cold pressure fusing a conductive path and said electrically conductive material together through said window.
A method for manufacturing a conductive network comprising the steps of
- a) providing a planar electrically conductive sheet;
- b) forming said electrically conductive sheet into a non-planar pattern;
- c) providing a layer of dielectric material fast on a first side of said electrically conductive sheet;
- and
- d) removing portions of said electrically conductive sheet from a second side of said electrically conductive sheet to form electrically insulated conductive paths.
Dependencies are inferred from the claim text.