Process for separating acceleration sensors constructed as differential capacitors

A process for separating acceleration sensors, which are constructed as differential capacitors and, which are produced from a glass-silicon-glass layer package, wherein a disk-shaped silicon layer has a grid structure with flexural resonators which are cut free therefrom, and further wherein a plurality of glass disks, which are bonded with the silicon disk, carry metal layers which face plate-shaped masses of the flexural resonators, and further wherein metal layers have substantially identical surface areas and are connected so as to be electrically conductive with connection contacts which are arranged on a glass disk, which comprises the steps of:

• providing a notch in said glass-silicon-glass layer package in a cross-wise manner;
• performing a first cutting operation so as to make first cuts, which are reciprocal cuts, at least in one direction and in two parallel planes in order to free said connection contacts;
• providing an intermediate layer, for preventing a bonding connection, between webs of said silicon layer which serves to support said plurality of glass disks and, in particular, supports at least one of said plurality of glass disks which carries said connection contacts prior to bonding, at least in an edge area between an outer cutting plane, for freeing acceleration sensor connection contacts;
• and
• performing a breaking operation so as to break said layer package at predetermined breaking points which are created by at least one of said first cutting operation and a second cutting operation.