US 5,342,203 A · Low profile backshell/wiring integration and interface system

Abstract

Multiple conductor wire harnesses in aircraft or the like are interconnected by a single low profile compact backshell assembly. The backshell assembly includes a housing which shields the individual conductors in the housing from ambient EMI noise. The housing has one or more wire harness inlet assemblies and a plurality of outlet sockets. One or more semi-flexible circuit boards are disposed in the housing and are operable to interconnect the individual conductor wires in each inlet with pin and socket conductor connections at the respective outlets. The circuit board provides interconductor EMI noise shielding inside of the housing. Splice connections between conductors can be formed as necessary within the circuit board inside of the housing to allow any degree of inlet to outlet conductor signal paths to be formed inside of the housing as are desired.

Claims14

Dependent claims

An interface system for interconnecting individual conductor wires to multi-conductor bundle harnesses in a grounded environment, said system comprising:

a) an ambient-EMI shielding housing which is grounded to said grounded environment;
b) a multi-conductor bundle harness having an outer EMI shielding;
and a plurality of conductor wires shielded from ambient EMI by said outer shielding, and said conductor wires being shielded from inter-conductor EMI by inner individual EMI shields;
c) a conductor housing mounted on said shielding housing, said conductor housing including means forming a plurality of signal-conducting connectors therein;
d) circuit board means mounted in said shielding housing, said circuit board means having a first array of conductive sockets, and a second array of conductive sockets;
a plurality of conductive paths in said circuit board means operable to connect each of said conductive sockets in said first array with at least one of said conductive sockets in said second array, each of said conductive paths being shielded from inter-conductor path EMI;
e) means connecting each of said conductive wires with an associated one of said conductive sockets in said first array;
and
f) means connecting each of said signal-conducting connectors with an associated one of said conductive sockets in said second array.

6 more elements

Dependencies are inferred from the claim text.

Low profile backshell/wiring integration and interface system

Life of this patent

Low profile backshell/wiring integration and interface system

Life of this patent

Abstract

Claims14