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AssigneeHitachi, Ltd.
InventorsToru Nishikawa, Ryohei Satoh, Masahide Harada, Tetsuya Hayashida, Mitugu Shirai
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In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimental recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.
A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
A method of soldering for use in fabricating an electric circuit device, comprising the steps of:
A method of soldering for use in fabricating an electric circuit device, comprising the steps of:
A method of soldering for use in fabricating an electric circuit device, comprising the steps of:
A fluxless bonding method for bonding connecting members of an integrated circuit, comprising the steps of:
The method claimed in claim 27, wherein said non-oxidizing atmosphere is a mixture of H.sub.2 and N.sub.2 and wherein said non-oxidizing atmosphere during the heating is controlled by controlling concentration of said mixture.
Dependencies are inferred from the claim text.