Method of fabricating integrated circuit module

A method of fabricating an integrated circuit module which comprises - a) an integrated circuit chip having a plurality of input/output pads in a pattern on a surface thereof, and b) an interconnect member having a surface with input/output pads in a pattern that matches said pattern of pads on said integrated circuit chip;

• said method including the steps of:
• forming an electrical insulating layer on one of said surfaces with a predetermined number of holes with vertical sidewalls which encompass said pads on said one surface, and forming a single solder ball on each of said pads on the other surface;
• randomly placing said solder balls in contact with said insulating layer such that said matching patterns of input/output pads are randomly misaligned with each other;
• and,
• sliding said surface with said solder balls parallel to said insulating layer, in random directions, until said solder balls drop into said holes of said insulating layer.