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US 5,339,068 AGranted
Conductive chip-type ceramic element and method of manufacture thereof
AssigneeMitsubishi Materials Corporation
InventorsMasakiyo Tsunoda, Hiroaki Nakajima, Masami Koshimura
Life of this patent
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Abstract
A chip-type ceramic element contains a terminal electrode at each end and an inorganic insulating layer on the surface of the ceramic element between the electrodes. The terminal electrodes include a baked electrode formed from a conductive paste reacted with the material of the inorganic insulating layer. Layers of nickel and tin are plated on the baked electrode for improved heat resistance and soldering adhesion, respectively. The insulating layer prevents unwanted portions of the terminal electrodes from coming into contact with the ceramic element, thereby preventing dispersion in the resistance values of the element.
Claims38
A chip-type ceramic element comprising:
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- said insulating layer covering at least a portion of said ceramic body;
- each said terminal electrode including a first layer contacting said ceramic body;
- and
- said first layer being a baked electrode layer, wherein said baked electrode layer is a burned combination of said insulating material and a conductive paste.
4 more elements
A chip-type ceramic element comprising:
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- said insulating layer covering at least a portion of said ceramic body;
- each said terminal electrode including a first layer contacting said ceramic body;
- said first layer being a baked electrode layer, wherein said baked electrode layer is a burned combination of said insulating material and a conductive paste;
- and
- each said terminal electrode includes a second layer of nickel on said baked electrode layer;
- and
- each said terminal further includes
- a third layer of tin on said second layer.
8 more elements
A chip-type ceramic element comprising:
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- wherein said insulating layer covers an entire surface of said ceramic body except for portions of said ceramic body covered by each of said terminal electrodes;
- each said terminal electrode including a first layer contacting said ceramic body;
- and
- said first layer being a baked electrode layer, wherein said baked electrode layer is a burned combination of said insulating material and a conductive paste.
4 more elements
A chip-type ceramic element comprising:
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- said insulating layer covering at least a portion of said ceramic body;
- each said terminal electrode including a first layer contacting said ceramic body;
- said means for electrically connecting including openings in said insulating layer produced by reaction of said insulating layer with said baked electrode layer;
- said first layer being a baked electrode layer, wherein said baked electrode layer is a burned combination of said insulating material and a conductive paste;
- said insulating layer including at least 50% by weight SiO.sub.2 ;
- a remainder of said insulating layer being at least one oxide selected from the group consisting of Al.sub.2 O.sub.3, MgO, ZrO.sub.2, and TiO.sub.2 ;
- said conductive paste including a binding material;
- and
- said binding material including at least one oxide selected from the group consisting of SiO.sub.2, B.sub.2 O.sub.3, Na.sub.2 O, PbO, ZnO, TiO.sub.2, K.sub.2 O and BaO.
9 more elements
A chip-type element comprising:
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- said insulating layer covering at least a portion of said ceramic body;
- each said terminal electrode including a first layer contacting said ceramic body;
- said first layer being a baked electrode layer, wherein said baked electrode layer is a burned combination of said insulating material and a conductive paste;
- said insulating layer including at least one oxide selected from the group consisting of SiO.sub.2, B.sub.2 O.sub.3, Na.sub.2 O PbO, ZnO and BaO;
- said conductive paste including a binding material;
- and
- said binding material including at least one oxide selected form the group consisting of SiO.sub.2, B.sub.2 O.sub.3, Na.sub.2 O, PbO, ZnO, TiO.sub.2, K.sub.2 O and BaO.
7 more elements
A chip-type element comprising:
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- said insulating layer covering at least a portion of said ceramic body;
- each said terminal electrode including a first layer contacting said ceramic body;
- and
- said first layer being a baked electrode layer, wherein said baked electrode layer is a burned combination of said insulating material and a conductive paste;
- a conductive inner electrode on each of said opposing end surfaces;
- said insulating layer covering said conductive inner electrode;
- said baked electrode layer covering a portion of said insulating layer;
- and
- means for electrically connecting said conductive inner electrode to said baked electrode layer;
- said means for electrically connecting including openings in said insulating layer produced by reaction of said insulating layer with said baked electrode layer.
10 more elements
A chip-type ceramic element comprising;
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- said insulating layer covering at least a portion of said ceramic body;
- each said terminal electrode including a first layer contacting said ceramic body;
- and
- said first layer being a baked electrode layer, wherein said baked electrode layer is a burned combination of said insulating material and a conductive paste, and wherein a melting point of said insulating layer is higher than a temperature used to form said baked electrode layer.
4 more elements
A chip-type ceramic element comprising:
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- said insulating layer covering at least a portion of said ceramic body;
- each said terminal electrode including a baked electrode layer;
- at least a portion of said baked electrode being a baked combination of said insulating material and a conductive paste;
- and
- said conductive paste being a combination of a metal powder and an inorganic binding material.
5 more elements
A chip-type ceramic element comprising:
- a conductive ceramic body having opposing end surfaces;
- a terminal electrode covering each of said opposing end surfaces;
- an insulating layer made from an inorganic insulating material;
- said insulating layer covering at least a portion of said ceramic body;
- each said terminal electrode including a first inner electrode layer;
- each said terminal electrode including a second baked electrode layer;
- said baked electrode layer being a baked combination of said insulating material and a conductive paste;
- and
- said conductive paste being a combination of a metal powder and an inorganic binding material.
6 more elements
A method of producing a chip-type element comprising:
- burning a chip to produce a ceramic body;
- covering at least peripheral sides of said ceramic body with an insulating material;
- applying a conductive paste to a wrapping portion of said insulating material at opposing end surfaces of said body;
- and
- reacting said conductive paste with said insulating layer to form an electrode in electrical contact with each said portion.
2 more elements
Dependencies are inferred from the claim text.