Apparatus for ion implantation including contactless cooling and beam current measurement means
AssigneeNissin High Voltage Co., Ltd.
InventorKunihiko Takeyama
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AssigneeNissin High Voltage Co., Ltd.
InventorKunihiko Takeyama
Estimating the term…
Wafer disk holds wafers in position by centrifugal force and its rotating shaft is supported by a bearing capable of magnetic levitation that has a thrust bearing and radial bearings. An annular groove providing a heat radiating zone is formed under the wafer receiving faces of the wafer disk. A cooling plate cooled to a temperature not exceeding the temperature of liquid nitrogen is inserted into the groove in a contactless manner so that the wafer disk is cooled by heat radiation. In the absence of any area of physical contact in the mechanisms for axially supporting and cooling the wafer disk, ions can be implanted in low dose into wafers on the fast rotating disk while improving the quality of wafers after implantation. Further, no triboelectricity will develop, thereby contributing to an improvement in the precision of ion beam current measurement.
An apparatus for ion implantation, comprising:
An apparatus for ion implantation comprising:
An apparatus for ion implantation, comprising:
Dependencies are inferred from the claim text.