Method and apparatus for making printed circuit boards
OwnerGeorge D. Gregoireinventor
Life of this patent
Estimating the term…
Loading patent…
OwnerGeorge D. Gregoireinventor
Estimating the term…
A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.
In a method of making a printed circuit board including a planar substrate having thereon a desired electrical circuit pattern with metallized solder lands thereof disposed out of the plane of the substrate, the steps of making a three dimensional female predecessor tool, comprising:
In a method of making a printed circuit board including a planar substrate having thereon a desired electrical circuit with metallized solder lands thereof disposed out of the plane of the substrate, the steps of making a three dimensional male tool, comprising:
A method of making a metallized plastic member, comprising:
A method of making a metallized plastic member comprising:
A method of making a metallized plastic member comprising:
A method of making a metallized plastic member comprising:
Dependencies are inferred from the claim text.