Integrated-circuit package
AssigneeNgk Spark Plug Co., Ltd.
InventorMasao Kuroda
Life of this patent
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Abstract
An object to the present invention is to provide an integrated-circuit package in which crosstalk can be reduced and impedance matching can be made. According to the present invention, conductive poles are grid-like arranged equidistantly in rows respectively in the vertical and transversal directions of an insulating substrate. The conductive poles are classified into signal conductive poles which are electrically connected to electrodes of the integrated circuit and the mother board, and earthed ground conductive poles arranged so as to adjacently surround the signal conductive poles.
Claims7
An integrated circuit package comprising:
- a plate-like insulating substrate;
- and
- a plurality of conductive poles including signal conductive poles and ground conductive poles, said signal and ground conductive poles penetrated into said plate-like insulating substrate,
- wherein at least one of said signal conductive poles is surrounded by at least some of said ground conductive poles.
An integrated circuit package comprising:
- a plate-like insulating substrate;
- and
- a plurality of conductive poles including signal conductive poles and ground conductive poles, said signal conductive poles penetrated into said plate-like insulating substrate,
- wherein one of said ground conductive poles is disposed between said signal conductive poles adjacently arranged.
Dependencies are inferred from the claim text.