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US 5,331,507 AGranted
Clip for mounting a heat sink on an electronic device package
AssigneeDell USA, L.P.
InventorsJohnny S. Kyung, Pearce R. Jones
Life of this patent
Estimating the term…
Abstract
A resilient heat sink clip has a pair of legs joined together at one end by an acruate member. The other ends of the legs each terminate in a hook. The arcuate member bears against a heat sink while pressing it into thermal contact with an electronic device package to conduct heat into the heat sink and then into the atmosphere.
Claims4
Apparatus mounting a heat sink on an electronic device package having a plurality of leads connected through a socket mounted on a printed circuit board, to the printed circuit board comprising:
- (a) a clip having a pair of legs spaced apart at their first ends by a contiguous connecting member, the member being pressed against the heat sink;
- and
- (b) aperatures in the printed circuit board, receiving and securing the second ends of the legs to provide a firm force by the member against the heat sink.
Dependencies are inferred from the claim text.